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Optimal for transporting thin components, such as paper, vinyl sheets.
- As the lip has been made thinner, not only has its adhesion to components been improved, but overlapping adhesion has also been minimized.
- Existing pad holder (A,B,C,D type) are downsized and realized space saving.
- Pad replacement can be done without removing pad holders from equipments as it was used to be.
- The pad holder required for "No copper alloy" and "Low level ozone resistance" is available. No copper alloy is applied for metal parts and HNBR is used for seal materials.
Specifications
